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Our Instruments

The Materials Characterization Core in the Bossone Research Enterprise Center (Bossone 106) provides access to a range of tools for the analysis of material structures at the nanoscale. Click the “More Info” links for details on each instrument’s capabilities and peripheral equipment. 

Electron Microscopy Tools:

Zeiss Supra 50VP field-emission scanning electron microscope (SEM)

provides high-resolution morphological and surface structural data.

Technical Capabilities

  • High-resolution secondary imaging in high vacuum mode
  • Operating acceleration voltage from 100v to 30Kv
  • Five-axis stage
  • Everhart-Thornley and Zeiss Gemini in-lens secondary electron detectors
  • Dedicated backscattered electron detector
  • Oxford UltiMax 40mm energy dispersive spectrometer for elemental analysis

Please contact Edward Basgall (ejb63@drexel.edu) for more information and to arrange training.

FEI XL30 environmental scanning electron microscope (ESEM)

provides high-resolution morphological and surface structural data.

Technical Capabilities

  • High-resolution secondary electron imaging in high vacuum mode
  • Accelerating voltage range 100v to 30Kv
  • Five-axis stage
  • Two dedicated backscatter electron detectors
  • EDAX energy dispersive spectrometer for elemental analysis
  • EDAX Orientation Image Mapping (OIM) for electron backscatter diffraction measurement
  • Variable pressure and wet modes with water-cooled/heated temperature controlled stage
  • GSE detectors for imaging under hydrated low- vacuum conditions

Please contact Edward Basgall (ejb63@drexel.edu) for more information and to arrange training

FEI Strata DB235 focused ion beam scanning electron microscope (FIBSEM)

combines a high-resolution field emission scanning electron microscope with gallium focused ion column capable of ion milling material at the nanoscale.

Technical Capabilities

  • High-resolution secondary electron imaging (3 nm resolution)
  • Gallium ion milling
  • Electron beam and ion beam deposition of Pt metal
  • Energy dispersive spectroscopy and X-ray fluorescence for elemental analysis
  • Omniprobe 200A for lift-out preparation of transmission electron microscope samples

Please contact Craig Johnson (clj46@drexel.edu) for more information and to arrange training

JEOL 2100 transmission electron microscope (TEM)

offers a robust platform for basic transmission electron imaging and diffraction experiments.

Technical Capabilities

  • LaB6 thermionic electron source
  • High-resolution objective lens (0.2 nm resolution)
  • Electron diffraction
  • Gatan Orius SC1000 CCD camera and DigitalMicrograph software
  • Single tilt, double-tilt and high-tilt tomography holders available
  • SerialEM tomography acquisition software

Please contact Craig Johnson (clj46@drexel.edu) for more information and to arrange training

JEOL 2100F field-emission transmission electron microscope (FTEM)

combines high-resolution TEM imaging with scanning TEM (STEM) and analytical capabilities.

Technical Capabilities

  • High-brightness Schottkey field-emission electron source
  • High-resolution objective lens (0.2 nm resolution)
  • Bright-field, annular dark-field and high-angle annular dark-field STEM imaging (0.2 nm resolution)
  • Oxford XMax 80T silicon drift detector for elemental analysis and mapping
  • Gatan Ultrascan CCD camera and DigitalMicrograph (GMS3) software
  • Single tilt, double-tilt and high-tilt tomography holders available
  • SerialEM tomography acquisition software

Please contact Craig Johnson (clj46@drexel.edu) for more information and to arrange training

X-ray Diffraction Tools:

Rigaku SmartLab X-ray diffractometer (XRD)

provides a complete range of structural measurements including powder diffraction, thin film metrology including thin-film method, preferred orientation, crystal quality, reflectometry and grazing angle measurements.

Technical Capabilities

  • 2.2 kW X-ray generator configured with long focus sealed Cu Kα X-ray tube
  • Five axis goniometer circle with a range of -30° to 1600° 2θ
  • Interchangeable cross-beam optics includes Bragg Brentano and Parallel Beam optics
  • Ge220x2 and Ge 220x4 monochromator
  • Anton Paar hot stage option for in situ heating up to 1100 °C
  • SmartLab Guidance acquisition software, analytical software PDXL2 for qualitative and quantitative package with connected PDF2 database.

Please contact Dmitri Barbash (dvb36@drexel.edu) for more information and to arrange training

Rigaku Miniflex X-ray diffractometer (XRD)

is a powerful, fast and flexible benchtop XRD system designed for high-throughput analysis of the variety of polycrystalline samples.

Technical Capabilities

  • 600W X-ray Generator (40 kV and 15 mA)
  • Highly reliable and rugged vertical goniometer with sample mounted in horizontal position. Goniometer Radius 150 mm minimizes intensity loss due to air scattering.
  • Measuring range: -3° to ~ 145° 2θ. Scanning speed: 0.01° - 100° 2θ / min,
  • Scintillation Counter Detector
  • MiniFlex Guidance acquisition Software, PDXL 2 Quantitative and Quantitative Package with connected NIST and COD Crystal Structure databases.
  • Standard sample stage for a wide range of standard sample holders
  • Air-tight sample container

Please contact Dmitri Barbash (dvb36@drexel.edu) for more information and to arrange training

Rigaku S-MAX 3000 small angle X-ray scattering system (SAXS)

provides information about particle size distribution, orientation, shape and size of ordered materials with d-spacing ranging from 10 to 100nm.

Technical Capabilities

  • Microfocused 20x20 microns Cu- X-ray source with 45kV, 0.88m Amp power
  • Source to Detector Distance of 3000mm allows detection of dmax< 910 Å
  • 120mm diameter two-dimensional multiwire X-ray detector
  • Wide-angle X-ray scattering (WAXS) feature for d spacings from 0.1 to 1 nm.
  • Matlab analysis package
  • Linkam high-temperature stage for in-situ heating up to 300°C.

Please contact Dmitri Barbash (dvb36@drexel.edu) for more information and to arrange training

Surface Science Tools:

Physical Electronics VersaProbe 5000 X-ray photoelectron spectrometer (XPS)

provides elemental and chemical composition of the first ten nm of a sample surface. VersaProbe system combines XPS measurements with additionally upgraded to UVPS, Hot/Cold stage, C60 ion gun source accessories.

Technical Capabilities

  • Monochromatic Al K-Alpha (AlKα) souce of 1486.2 eV
  • Ar+ and C60+ ion guns for depth profile measurements
  • Dual-source neutralizer system for charge compensation
  • 180° hemispherical analyzer has high angular acceptance for small area XPS sensitivity
  • 16 channel MCD detector
  • Ultraviolet photoelectron spectroscopy (UPS) for measuring work function and Fermi level
  • Hot and cold stage for in-situ heating and cooling

Please contact Dmitri Barbash (dvb36@drexel.edu) for more information and to arrange training

MTS XP Nanoindenter

provides material hardness, Young’s modulus and other mechanical properties of materials.

Technical Capabilities

  • Displacement resolution < 0.02 nm using capacitance gauge; max depth 500 um
  • Coil/magnet load application assembly; max load 500 mN with resolution of 50nN
  • Contact force: <1µN
  • Spherical (1 µm, 5 µm, 20 µm, and 100 µm radius), Berkovich and scratch tips
  • Programmable and fully automated indentation modes
  • Nano continuous stiffness module allows continuous stiffness measurements
  • Nano Suite 5 testing software for simple experimental control and complete data analysis

Please contact Dmitri Barbash (dvb36@drexel.edu) for more information and to arrange training

Sample Preparation Tools:

Thermionics VE 90 thermal evaporator

allows deposition of thin metallic films.

Technical Capabilities

  • 2 thermal stations for sequential vertical metal evaporation without breaking vacuum
  • W metal boats for evaporation
  • Al, Cr, Cu, Ni base metals – CRF supplied. Au, Pt, Ag precious metals – user supplied
  • Water-cooled temperature monitor and Inficon quartz-crystal thickness monitor

Please contact Edward Basgall (ejb63@drexel.edu) for more information and to arrange training

Fischione 1010 low-angle ion mill

allows precision Argon ion-beam thinning of TEM samples for electron transparency.

Technical Capabilities

  • 0.5 to 5 kV focused argon ion beams
  • Liquid nitrogen sample cooling
  • Software user interface

Please contact Craig Johnson (clj46@drexel.edu) for more information and to arrange training

Leica EM UC6 ultramicrotome

allows preparation of electron transparent sections of soft materials for transmission electron microscopy.

Technical Capabilities

  • Room temperature and cryo (liquid N2) ultramicrotomy capable
  • Microproccessor-controlled temperature, cutting speed and thickness advance
  • Leica EM KMR2 glass knife maker

Please contact Edward Basgall (ejb63@drexel.edu) for more information and to arrange training