Loyola University Chicago School of Law will host the 2020 Patent Law Interview Program on Thursday and Friday, July 23-24 in Chicago, Illinois. This nationwide interview program targets patent law employers interested in hiring rising 2L and 3L students.
Last year roughly 150 employers, 190 law schools, and 1,100 law students from across the country participated in the program. Keep in mind that there are a limited number of Philadelphia Area IP employers, so we strongly advise law students to cast a wide net, be adventurous, and interview at this important IP Job Fair. Yes, this requires that you fly or drive to Chicago and commit to spending at least one night, but we think this is an investment that is worth your consideration.
The program is entirely pre-selected, which means that students submit application materials to the employers they are interested in, and employers then review their materials and select the students they wish to interview at the program. Last year, approximately half of the participating students were selected for interviews. We know that two KSoL students received big firm summer associate offers.
Students with undergraduate or graduate degrees in engineering or a technical science should consider registering for the program. You do not need to be patent bar eligible to register, although the vast majority of employers participating in the program are seeking patent bar eligible students.
For more information on the program, please refer to the Loyola Patent Program website.
Online student registration for this year’s Patent Law Interview Program started February 3. The Career Strategies Office handles registration and payment for Kline School of Law students. To register, please complete and return the attached registration form to Jen Moore by February 27. Please note the $40 dollar registration fee is non-refundable and will be paid directly by CSO.
Once registration closes, the Loyola Interview Program staff will communicate with you directly via email to the address you provided on the registration form. You will upload application materials and bid on interviews later in the semester. Please direct any questions about the program to the Patent Program Liaison in our office, Jen Moore (email@example.com).